Provides guidelines considered effective for the assembly of printed board assemblies, i.e. the mounting of electronic components on printed boards, by a variety of techniques including surface mounting, through-hole mounting and mixed component mounting, depending on the type of component available and matching the component with the appropriate soldering technology. It also discusses design criteria and considerations of soldering, cleaning of printed boards and PBAs and handling of electrostatic sensitive devices.
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AS 2001.2.28-1992
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