BS 2011-2.1TD:1990

Environmental testing. Tests-Test Td. Solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

BSI Group , 08/31/1990

Publisher: BS

File Format: PDF

$46.00$93.00

Description

Procedure for testing the effects of soldering using a solder bath. Applicable only to products designed to withstand short term immersion in molten solder. To be read in conjunction with Part 1.1Cross References: BS 2011:Part 1.1*BS 2011:Part 2.1T*BS 2011:Part 2.1Ta*BS 2011:Part 2.2T*Replaced by BS EN 60068-2-58:1999 but remains current.

Published: 08/31/1990

Pages: 16

File Size: 1 file , 4.2 MB

ISBN: 058018806X

Language: English

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