Provides a guide to an interconnection system for circuit board partitioning, allowing for a modular construction and solderless assembly of the sub-units.Cross References:BS 2011:Part 1.1BS 2011:Part 2.1EaBS 2011:Part 2.1EbBS 2011:Part 2.1FcBS 2011:Part 2.1M BS 5954:Part 2BS 5954:Part 3BS CECC 00015:Part 1IEC 603-2
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