Specifies the data format for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally-packaged semiconductor die. It also gives definitions of all parameters used according to the principles and methods of IEC 61360.Cross References: ES 59008-1*ES 59008-2*ES 59008-3*ES 59008-4-1*ES 59008-4-3*ES 59008-4-4*IEC 61360*ISO 8601:1988*ANSI X3.30*ISO 6093:1985*
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