This part of IEC 60286 contains information about the introduction of an innovative bulk blisterpacking system for miniaturized components, for example chip type components of size 1005(metric) and smaller. It includes a proposal for standardization of the interface between thepackaging and automatic assembly systems and requirements to the properties of thepackaging.Cross References:IEC 60286-3:2019IEC 61340-5-3:2015IEC 62090:2017IEC 61340-5-1:2016
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