This part of IEC 60068 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder paste.
Data obtained by these methods are not intended to be used as absolute quantitative data for pass/fail purposes.
NOTE Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 specifies visual evaluation using solder bath and reflow method, IEC 60068-2-69 specifies wetting balance evaluation using solder bath and solder globule method.
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