IEC 60191-4 Amd.1 Ed. 3.0 b:2018

Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

International Electrotechnical Commission , 03/27/2018

Publisher: IEC

File Format: PDF

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Published: 03/27/2018

Pages: 29

File Size: 1 file , 670 KB

Language: English, French

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