IEC 60191-4 Ed. 2.2 b:2002

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages CONSOLIDATED EDITION

International Electrotechnical Commission , 10/22/2002

Publisher: IEC

File Format: PDF

$91.00$182.00

Description

Describes a method for the designation and the classification into forms of package outlines for semiconductor devices. Provides a systematic method for generating universal descriptive designators for semiconductor packages.

Published: 10/22/2002

Pages: 43

File Size: 1 file , 610 KB

Language: English, French

Note: This product is unavailable in Ukraine, Russia, Belarus

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