• Your shopping cart is empty!

  • IEC 60191-6-2 Ed. 1.0 b:2001

IEC 60191-6-2 Ed. 1.0 b:2001

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

International Electrotechnical Commission , 12/11/2001

Publisher: IEC

File Format: PDF

$25.00$51.00


IEC 60191-6-2:2001 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).

Published: 12/11/2001

Pages: 21

File Size: 1 file , 250 KB

Language: English, French

Note: This product is unavailable in Ukraine, Russia, Belarus

More Standards PDF

IEC 80601-2-35 Ed. 1.1 b:2016

IEC 80601-2-35 Ed. 1.1 b:2016

$264.00 $528.00

IEC 61987-16 Ed. 1.0 b:2016

IEC 61987-16 Ed. 1.0 b:2016

$95.00 $190.00

IEC 60695-8-2 Ed. 1.0 b:2016

IEC 60695-8-2 Ed. 1.0 b:2016

$117.00 $234.00

IEEE 2030.100-2017

IEEE 2030.100-2017

$41.00 $82.00