IEC 60191-6-2 Ed. 1.0 en:2001

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

International Electrotechnical Commission , 12/11/2001

Publisher: IEC

File Format: PDF

$31.00$62.00

Covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball and column terminal packages.

Published: 12/11/2001

Pages: 10

File Size: 1 file , 260 KB

Language: English

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