IEC 60191-6-21 Ed. 1.0 b:2010

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

International Electrotechnical Commission , 08/30/2010

Publisher: IEC

File Format: PDF

$47.00$95.00

Description

IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.

Published: 08/30/2010

Pages: 28

File Size: 1 file , 420 KB

Language: English, French

Note: This product is unavailable in Ukraine, Russia, Belarus

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