IEC 60191-6-5 Ed. 1.0 en:2001

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

International Electrotechnical Commission , 08/27/2001

Publisher: IEC

File Format: PDF

$25.00$51.00

Description

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.

Published: 08/27/2001

Pages: 10

File Size: 1 file , 330 KB

Language: English

Note: This product is unavailable in Ukraine, Russia, Belarus

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