IEC 60749-20 Ed. 1.0 b:2002

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

International Electrotechnical Commission , 09/30/2002

Publisher: IEC

File Format: PDF

$58.00$117.00

Description

Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices.

Published: 09/30/2002

Pages: 49

File Size: 1 file , 1.7 MB

Language: English, French

Note: This product is unavailable in Ukraine, Russia, Belarus

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