IEC 60749-22 Ed. 1.0 b:2002

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

International Electrotechnical Commission , 09/12/2002

Publisher: IEC

File Format: PDF

$95.00$190.00

Description

Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements

Published: 09/12/2002

Pages: 41

File Size: 1 file , 720 KB

Language: English, French

Note: This product is unavailable in Ukraine, Russia, Belarus

More Standards PDF

IEC 60601-1-8 Amd.2 Ed. 2.0 b:2020

$183.00 $367.00

IEC 60749-41 Ed. 1.0 b:2020

$95.00 $190.00

IEC 61326-2-4 Ed. 3.0 b:2020

$47.00 $95.00

IEC 62714-4 Ed. 1.0 b:2020

$227.00 $455.00