IEC 60749-22 Ed. 1.0 b:2002

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

International Electrotechnical Commission , 09/12/2002

Publisher: IEC

File Format: PDF

$95.00$190.00

Description

Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements

Published: 09/12/2002

Pages: 41

File Size: 1 file , 720 KB

Language: English, French

Note: This product is unavailable in Ukraine, Russia, Belarus

More Standards PDF

IEEE P802.11be

$182.00 $365.00

IEEE P1806-2021/Cor 1

$28.00 $56.00

IEEE P1210

$28.00 $56.00

IEEE 3304-2023

$28.00 $56.00