• Your shopping cart is empty!

PDF Preview

IEC 60749-22 Ed. 1.0 b:2002

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

International Electrotechnical Commission , 09/12/2002

Publisher: IEC

File Format: PDF

$95.00$190.00


Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements

Published: 09/12/2002

Pages: 41

File Size: 1 file , 720 KB

Language: English, French

Note: This product is unavailable in Ukraine, Russia, Belarus

More Standards PDF

IEC 60747-6-2 Ed. 1.0 b:1991

IEC 60747-6-2 Ed. 1.0 b:1991

$27.00 $54.00

IEC 60763-2 Ed. 1.0 b:1991

IEC 60763-2 Ed. 1.0 b:1991

$33.00 $67.00

IEC 61020-2 Ed. 1.0 b:1991

IEC 61020-2 Ed. 1.0 b:1991

$33.00 $66.00

IEC 60489-4 Ed. 2.0 b:1991

IEC 60489-4 Ed. 2.0 b:1991

$183.00 $367.00