IEC 61188-6-1 Ed. 1.0 b:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

International Electrotechnical Commission , 02/23/2021

Publisher: IEC

File Format: PDF

$139.00$278.00


IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.

More Standards PDF

ICC FL-BC-RESIDENTIAL-2014
IEC 62386-201 Ed. 2.0 b:2015
IEC 62341-2-1 Ed. 1.0 en:2015
IEC 62077 Ed. 3.0 b:2015

IEC 62077 Ed. 3.0 b:2015

$91.00 $183.00