IEC 61189-3 Ed. 1.0 b:1997

Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

International Electrotechnical Commission , 04/10/1997

Publisher: IEC

File Format: PDF

$78.00$157.00

Description

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers chemical, mechanical and electrical test methods.

Published: 04/10/1997

Pages: 105

File Size: 1 file , 500 KB

Language: English, French

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