IEC 61192-3 Ed. 1.0 b:2002

Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies

International Electrotechnical Commission , 12/17/2002

Publisher: IEC

File Format: PDF

$140.00$281.00


Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.

More Standards PDF

IEEE C37.73-1998

IEEE C37.73-1998

$70.00 $141.00

IEC 60669-1 Ed. 3.0 b:1998

IEC 60669-1 Ed. 3.0 b:1998

$187.00 $375.00

IEC 60904-10 Ed. 1.0 b:1998
IEC 60679-4-1 Ed. 1.0 b:1998