IEC 61249-8-8 Ed. 1.0 b:1997

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings

International Electrotechnical Commission , 06/24/1997

Publisher: IEC

File Format: PDF

$25.00$51.00

Description

Provides requirements for the qualification of temporary solder resist coatings. Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks.

Published: 06/24/1997

Pages: 19

File Size: 1 file , 120 KB

Language: English, French

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