• IEC 62047-18 Ed. 1.0 b:2013

IEC 62047-18 Ed. 1.0 b:2013

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

International Electrotechnical Commission , 07/17/2013

Publisher: IEC

File Format: PDF

$47.00$95.00


IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.

More Standards PDF

IEC 61290-1 Ed. 1.0 b:2014
IEC 62504 Ed. 1.0 b:2014

IEC 62504 Ed. 1.0 b:2014

$95.00 $190.00

IEC 62885-3 Ed. 1.0 en:2014
IEC 60810 Ed. 4.0 b:2014

IEC 60810 Ed. 4.0 b:2014

$176.00 $352.00