IEC 62951-5 Ed. 1.0 b:2019

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials

International Electrotechnical Commission , 02/27/2019

Publisher: IEC

File Format: PDF

$72.00$145.00


IEC 62951-5:2019 specifies the test method for thermal characteristics of flexible materials. This document includes terms, definitions, symbols, and test methods that can be used to evaluate and determine thermal characteristics of flexible materials for practical use. The measurement method relies on non-contact optical thermometry that is based on temperature dependent optical reflectance. This document is applicable to both substrate and thin-film flexible semiconductor materials that are subjected to bending and stretching.

More Standards PDF

IEC 60811-602 Ed. 1.0 b:2012
IEC 62396-2 Ed. 1.0 en:2012

IEC 62396-2 Ed. 1.0 en:2012

$117.00 $235.00

IEC 60512-28-100 Ed. 1.0 b:2013
IEC 60811-601 Ed. 1.0 b:2012