IEC 63068-2 Ed. 1.0 en:2019

Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 2: Test method for defects using optical inspection

International Electrotechnical Commission , 01/30/2019

Publisher: IEC

File Format: PDF

$95.00$190.00


IEC 63068-2:2019(E) provides definitions and guidance in use of optical inspection for detecting as-grown defects in commercially available 4H-SiC (Silicon Carbide) epitaxial wafers. Additionally, this document exemplifies optical images to enable the detection and categorization of the defects for SiC homoepitaxial wafers. This document deals with a non-destructive test method for the defects so that destructive methods such as preferential etching are out of scope in this document.

More Standards PDF

IEEE 802.1aq-2012

IEEE 802.1aq-2012

$154.00 $308.00

IEC 60335-2-39 Ed. 6.0 b:2012
IEC 61010-2-033 Ed. 1.0 b:2012
IEC 62755 Ed. 1.0 en:2012

IEC 62755 Ed. 1.0 en:2012

$221.00 $443.00