This part of IEC 63378 specifies three-dimensional (3D) thermal models of discrete semiconductor packages (TO-243, TO-252 and TO-263), utilized in the steady-state thermal analysis of electronic devices to estimate junction temperatures accurately.
This model is assumed to be made by semiconductor suppliers and to be used by assembly makers of electronic devices.
More Standards PDF
ICC NC-BC-2018
$60.00 $121.00
IEC 61249-2-45 Ed. 1.0 en:2018
$95.00 $190.00
IEC 60404-9 Ed. 2.0 b:2018
$72.00 $145.00
IEEE 2030.8-2018
$33.00 $66.00