This document provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability, Environment, Reuse) process for layout of printed board assemblies that utilize surface mount and through hole devices.
More Standards PDF
IPC 4412:2002
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IPC 2252:2002
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IEST RP-CC028.1
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IPC J-STD-032:2002
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