• IPC 4104:1999

IPC 4104:1999

Specifications for High Density Interconnect (HDI) and Microvia Materials

Association Connecting Electronics Industries , 05/01/1999

Publisher: IPC

File Format: PDF

$71.00$142.00


Covers the various conductive and dielectric materials that can be used for the fabrication of HDI and microvias.The 23 specification sheets included in IPC/JPCA-4104 specify the qualification and conformance requirements for such materials as photoimageable dielectric dry films and liquids, epoxy blends and coated foils. IPC/JPCA-4104 also includes six new test methods developed specifically for the testing of HDI and microvia materials.

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