IPC J-STD-027:2003

Mechanical Outline Standard for Flip Chip or Chip Scale Configurations

Association Connecting Electronics Industries , 02/01/2003

Publisher: IPC

File Format: PDF

$50.00$101.00

Description

THis standard establishes mechanical outline requirements for devices supplied in flip chip or CHip Size Package (CSP) formats. including die surface, die terminals, and interconnection balls/bumps/lands to the next level.

Published: 02/01/2003

Pages: 20

File Size: 1 file , 90 KB

Language: English

Note: This product is unavailable in Russia, Ukraine, Belarus

More Standards PDF

IPC J-STD-001G:2017

$91.00 $182.00

IPC 1401:2017

$46.00 $93.00

IPC 7530A:2017

$91.00 $182.00

IPC J-STD-003C-WAM1&2:2017

$91.00 $182.00