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This specification covers a room-temperature-vulcanizing, elastomeric silicone compound in the form or a base compound and a catalyst.
This compound has been used typically for potting and encapsulating electronic products for use at temperatures from -50 to +260 degrees C (-58 to +500 degrees F) where resistance to reversion is not required, but usage is not limited to such applications.
This specification covers a room-temperature-vulcanizing, elastomeric silicone compound in the form or a base compound and a catalyst.
This compound has been used typically for potting and encapsulating electronic products for use at temperatures from -50 to +260 degrees C (-58 to +500 degrees F) where resistance to reversion is not required, but usage is not limited to such applications.
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