This specification covers a high-temperature, electrical-grade, polyimide resin adhesive in the form of film or paste. This product has been used typically as an adhesive for bonding polyimide-laminate-faced sandwich structures in radar-transparent assemblies, but usage is not limited to such applications. The adhesive is useful over the temperature range -55 degrees to +315 degrees C (-67 degrees to +600 degrees )F.
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