This specification covers a two-component adhesive compound, an epoxy resin base and a hardener, in the form of a paste.
This compound has been used typically for non-structural bonding of metals and thermosetting plastics, to themselves and to each other, and as an adhesive for electrical components and devices operating at not higher than 260 degrees C (500 degrees F), but usage is not limited to such applications.
This compound has been used typically for non-structural bonding of metals and thermosetting plastics, to themselves and to each other, and as an adhesive for electrical components and devices operating at not higher than 260 degrees C (500 degrees F), but usage is not limited to such applications.
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