This Addendum specifies additional requirements for a telecommunications bonding and grounding system when using structural metal in place of the telecommunications bonding backbone (TBB) or grounding equalizer (GE).
Purpose
The purpose of this Addendum is to provide additional requirements for a telecommunications bonding and grounding system when using structural metal as a telecommunications bonding backbone.
More Standards PDF
TIA J-STD-100
$82.00 $164.00
TIA TIA-1137.100-1
$92.00 $184.00
SSPC PS 28.01
$89.00 $179.00
SSPC Quality Forms
$89.00 $179.00