Published annually in April.
This volume contains 125 standards.
Subjects cover:
- Innerlayer Interconnections and Bonding
- Materials and Processes for Vacuum Tubes
- Electronic Device Characterization
- Hermetic Seals
- Hybrid Circuits and Substrates
- Microelectronic Packaging
- Leak Testing
- and more
ASTM Volume 10.04:2014 History
ASTM Volume 10.04:2024
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