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  • BS 3934-5:1997

BS 3934-5:1997

Mechanical standardization of semiconductor devices-Recommendations applying to tape automated bonding (TAB) of integrated circuits

BSI Group , 09/15/1997

Publisher: BS

File Format: PDF

$154.00$309.00


Applicable to the finished component supplied to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).

Published: 09/15/1997

Pages: 38

File Size: 1 file , 940 KB

ISBN: 0580278123

Language: English

Note: This product is unavailable in Ukraine, Russia, Belarus

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