Specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally-packaged semiconductor die. Also gives recommendations for general industry good practice in its use. To be read in conjunction with PD ES 59008-1Cross References: ES 59008-1*ES 59008-2*ES 59008-4*ES 59008-5*ES 59008-6-1*ES 59008-6-2*IEC 60191 *IEC 61360-1:1995*EIA/JESD30-B*EIA/JEP95*BS 3934*
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