IEC 60191-6-12 Ed. 1.0 en:2002

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type

International Electrotechnical Commission , 06/14/2002

Publisher: IEC

File Format: PDF

$50.00$100.00

Description

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.

Published: 06/14/2002

Pages: 20

File Size: 1 file , 490 KB

Language: English

Note: This product is unavailable in Ukraine, Russia, Belarus

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