IEC 60191-6-4 Ed. 1.0 en:2003

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

International Electrotechnical Commission , 06/11/2003

Publisher: IEC

File Format: PDF

$46.00$92.00

Covers the requirements for the measuring methods of ball grid array (BGA) dimensions.

Published: 06/11/2003

Pages: 16

File Size: 1 file , 500 KB

Language: English

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