IEC 60191-6-8 Ed. 1.0 b:2001

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

International Electrotechnical Commission , 08/27/2001

Publisher: IEC

File Format: PDF

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Description

IEC 60191-6-8:2001 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP.

Published: 08/27/2001

Pages: 22

File Size: 1 file , 330 KB

Language: English, French

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