This part of IEC 60317 specifies general requirements of enamelled round copper winding wires with or without bonding layer. The main changes with respect to the previous edition are:
- addition of Grade 3 minimum insulation increases and maximum overall diameters for wires up to 0,071 mm nominal conductor diameter in Tables 1 and A.1;
- revisions to minimum increase in bonding layer for wires up to 0,100 mm nominal conductor diameter in Tables 2 and A.2;
- addition of Grade 3 dielectric breakdown requirements for wires up to 0,071 mm nominal conductor diameter; and
- new pin hole test requirement for Grade 3 polyurethane wires.
This standard is to be read in conjunction with the IEC 60851 series. The clause numbers used in this part of IEC 60317 are identical with the respective test numbers of IEC 60851.
- addition of Grade 3 minimum insulation increases and maximum overall diameters for wires up to 0,071 mm nominal conductor diameter in Tables 1 and A.1;
- revisions to minimum increase in bonding layer for wires up to 0,100 mm nominal conductor diameter in Tables 2 and A.2;
- addition of Grade 3 dielectric breakdown requirements for wires up to 0,071 mm nominal conductor diameter; and
- new pin hole test requirement for Grade 3 polyurethane wires.
This standard is to be read in conjunction with the IEC 60851 series. The clause numbers used in this part of IEC 60317 are identical with the respective test numbers of IEC 60851.
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