IEC 60317-21:2013+A1:2019 specifies the requirements of solderable enamelled round copper winding wire of class 155 with a dual coating. The underlying coating is based on polyurethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is based on polyamide resin.
IEC 60317-21 Ed. 3.1 b:2019 History
IEC 60317-21 Ed. 3.1 b:2019
$69.00 $139.00
IEC 60317-21 Ed. 3.0 b:2013
$47.00 $95.00
More Standards PDF
IEC 61854 Ed. 1.0 b:1998
$140.00 $281.00
IEC 61897 Ed. 1.0 b:1998
$82.00 $164.00
IEEE C57.121-1998
$68.00 $137.00
IEEE 1012a-1998
$70.00 $141.00











