Determines the suitability of press-in connections under specified mechanical, electrical and atmospheric conditions. Is applicable to solderless press-in connections for use in telecommunication equipment and in electronic devices employing similar techniques. Changes with respect to the previous edition deal with: use of four layer test boards; sample tolerance range requirements; use of platings other than tin or tin/lead.
IEC 60352-5 Ed. 3.0 b:2008 History
IEC 60352-5 Ed. 5.0 en:2020
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IEC 60352-5 Ed. 5.0 b:2020
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IEC 60352-5 Ed. 4.0 b:2012
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IEC 60352-5 Ed. 3.0 b:2008
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