Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.
IEC 60749-21 Ed. 1.0 b:2005 History
IEC 60749-21 Ed. 2.0 b:2011
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IEC 60749-21 Ed. 1.0 b:2005
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IEC 60749-21 Ed. 1.0 b:2004
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