The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.
More Standards PDF
IEC 60494-1 Ed. 2.0 b:2013
$117.00 $234.00
IEC 60519-10 Ed. 2.0 b:2013
$72.00 $145.00
IEC 61784-5-16 Ed. 1.0 b:2013
$139.00 $278.00
IEEE C62.92.3-2012
$40.00 $81.00