IEC 61300-3-3:2009 describes the procedure to monitor changes in attenuation and/or return loss of a component or an interconnecting device, when subjected to an environmental or mechanical test. Such a procedure is commonly referred to as active monitoring. In many instances, it is more efficient to monitor attenuation and return loss at the same time. This edition constitutes a minor revision. The change with respect to the previous edition is the structure of the document.
IEC 61300-3-3 Ed. 3.0 b:2009 History
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