Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.
More Standards PDF
IEC GUIDE 109 Ed. 3.0 b:2012
$72.00 $145.00
IEEE 1591.1-2012
$47.00 $95.00
IEC 61340-4-10 Ed. 1.0 b:2012
$23.00 $47.00
IEEE 1680.3-2012
$47.00 $95.00