IEC 61189-2 Ed. 1.0 b:1997

Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

International Electrotechnical Commission , 04/10/1997

Publisher: IEC

File Format: PDF

$83.00$166.00

Description

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers mechanical and environmental test methods.

Published: 04/10/1997

Pages: 139

File Size: 1 file , 1.2 MB

Language: English, French

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