IEC 61189-3 Ed. 2.0 en:2007

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

International Electrotechnical Commission , 10/09/2007

Publisher: IEC

File Format: PDF

$158.00$317.00

Description

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. The major changes with regard to the previous edition concern the addition of 25 new test methods and the deletion of Annex B.

Published: 10/09/2007

Pages: 118

File Size: 1 file , 4.6 MB

Language: English

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