IEC 61191-2:2013 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.). This edition includes the following significant technical changes with respect to the previous edition:
- IPC-A-610 on workmanship has been included as a normative reference;
- some of the terminology used in the document has been updated;
- references to IEC standards have been corrected;
- the use of lead-free solder paste and plating are addressed.
- IPC-A-610 on workmanship has been included as a normative reference;
- some of the terminology used in the document has been updated;
- references to IEC standards have been corrected;
- the use of lead-free solder paste and plating are addressed.
IEC 61191-2 Ed. 2.0 b:2013 History
IEC 61191-2 Ed. 3.0 b:2017
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IEC 61191-2 Ed. 3.0 en:2017
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IEC 61191-2 Ed. 2.0 b:2013
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IEC 61191-2 Ed. 1.0 b:1998
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