IEC 61837-2:2018(E) deals with standard outlines and terminal lead connections as they apply to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures, and is based on IEC 61240:2016. This edition includes the following significant technical changes with respect to the previous edition:
a. revision of the figures to match the notation of the drawings of IEC 61240:2016;
b. addition of 7 enclosures as follows: DCC-6/5032A, DCC-6/3225A, DCC-4/3215C, DCC-6/2016A, DCC-2/2012C, DCC-2/1610C, DCC-4/1210C.
As a result, this third edition contains a total of 45 enclosure types, which are listed in Table 1.
a. revision of the figures to match the notation of the drawings of IEC 61240:2016;
b. addition of 7 enclosures as follows: DCC-6/5032A, DCC-6/3225A, DCC-4/3215C, DCC-6/2016A, DCC-2/2012C, DCC-2/1610C, DCC-4/1210C.
As a result, this third edition contains a total of 45 enclosure types, which are listed in Table 1.
IEC 61837-2 Ed. 3.0 en:2018 History
IEC 61837-2 Ed. 3.1 b:2020
$417.00 $835.00
IEC 61837-2 Ed. 3.1 en:2020
$417.00 $835.00
IEC 61837-2 Ed. 3.0 b:2018
$227.00 $455.00
IEC 61837-2 Ed. 3.0 en:2018
$227.00 $455.00
IEC 61837-2 Ed. 2.1 b:2014
$234.00 $469.00
IEC 61837-2 Ed. 2.0 b:2011
$176.00 $352.00
IEC 61837-2 Ed. 1.0 b:2000
$81.00 $163.00
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