IPC 2226:2003

Designers and manufacturers looking for the next level of guidance on building high density interconnect (HDI) boards will welcome IPC-2226. Used in conjunction with IPC-2221, this standard establishes requirements and considerations for high density interconnect (HDI) printed board design and its forms of component mounting and interconnecting structures. Based on years of industry manufacturing and design experience, the standard provides recommendations for signal, power, ground and mixed distribution layers, dielectric separation, via formation and metallization requirements and other design features that are necessary for HDI-advanced IC interconnection substrates. Trade-off analyses required to match the mounting structure to the selected chip set are included.