This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or without buried/blind vias, and metal cores.
The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017. The printed board may contain build up High Density Interconnect (HDI) layers.
IPC 6018D:2022 History
IPC 6018D:2022
$91.00 $182.00
IPC 6018C:2016
$91.00 $182.00
IPC 6018B:2011
$67.00 $135.00
IPC 6018A:2002
$67.00 $135.00
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