IPC 7525B:2011

Stencil Design Guidelines

Association Connecting Electronics Industries , 10/01/2011

Publisher: IPC

File Format: PDF

$50.00$101.00

Description

This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included.

Published: 10/01/2011

Pages: 36

File Size: 1 file , 2.1 MB

Language: English

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