IPC A-600F:1999

The definitive illustrated guide to printed wiring board acceptability! This four color document provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on printed boards. Make sure your operators, inspectors, and engineers have the most current industry concensus information. The F Revision provides new coverage on topics such as solder resist requirements and resin fill of blind and buried vias. Expanded coverage is also provided for measling and crazing of printed boards, annular ring requirements, plating voids for plated-through holes, flexible circuits, foil thickness for conductive patterns, and flatness requirements.